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1190A

Product description

  • The solder paste is a silver/copper-phosphorus alloy used for soldering copper-to-copper or copper-to-brass.
  • Additionally, the solder paste is mixed with a flux/binder tailored to individual requirements, such as flow properties, soldering process, and the specific base metals being soldered together.
  • The solder paste can be applied using an applicator.

Composition

Cu
Ag
P
75%
17,75%
7,25%
Melting range (℃): 643-644
ISO 17672: