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Flux

To achieve optimal wetting in the area to be soldered, both the workpiece and solder material must be free from grease and other impurities. Cleaning with degreasers or mechanical methods is recommended.

In addition to visible barriers, most metals are covered with an oxide layer, originating from oxygen in the surroundings. Therefore, the majority of silver soldering requires the removal of this oxide layer using a flux agent. Its function is to eliminate the metal oxides present on the work surface and the solder before soldering begins, and subsequently dissolve the oxides formed during the soldering process.

Choosing the correct flux is essential to ensure a good result. As a rule of thumb, the flux for a given task should be fully active 50 degrees below the solder’s melting point (at the solidus temperature), and its active range should continue at least 50 degrees above the solder’s liquidus temperature.

Note: Many fluxes contain fluorides, which, however, should not be confused with the mentioned PFAS (per- and polyfluoroalkyl substances). Refer to https://videnskab.dk/krop-sundhed/er-fluor-i-tandpasta-farligt/ for more information on fluorides not to be mistaken for PFAS substances.

ImageProduct nameActive temperature range (°C)ISO 18496Product info
SoftSolderFluxS1
180-350
SoftSolderFlux3S_2
180-350
EasyFloFlux
550-800FH10
AllRoundFlux
550-800FH 10
550-800FH 10
550-850FH 12
HighTempGradeFlux
575-825FH 10
550-970FH 10
750-1200FH 21
800-1300FH 21
800-1050

Relevant data sheets: