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Metalli 18P

Product description

  • Eutectic solder with 18% silver with self-fluxing properties when soldering copper-to-copper but can also be used for soldering brass-to-copper with flux.
  • The solder is free-flowing due to its high phosphorus content and can therefore be used for small gaps of ml. 0.025-0.075 mm.
  • The solder should not be used in joints exposed to large vibrations or shock loads.
  • Do not use for brazing ferrous alloys as the phosphorus will form intermetallic compounds with iron which weakens the strength of the joint.

Composition

Ag
Cu
P
18%
75%
7%
Melting range (℃): 645
ISO 17672:
CuP 286